Connectors for frequencies below 3 MHz for use with printed boards. Part 2: Detail specification for two-part connectors with assessed quality, for printed boards, for basic grid of 2,54 mm (0,1 in) with common mounting features
Edition 2005-05

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-601: General test methods for materials and assemblies - Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards
Edition 2021-03

Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
Edition 2018-11

Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
Edition 2017-06

Multimedia systems and equipment - Multimedia e-publishing and e-books technologies - Texture map for auditory presentation of printed texts
Edition 2016-03

Writing paper and certain classes of printed matter - Trimmed sizes - A and B series, and indication of machine direction (ISO 216:2007)
Edition 2008-10

Multimedia systems and equipment - Colour measurement and management. Part 7-1: Colour printers - Reflective prints - RGB inputs
Edition 2006-08

Printed board assemblies - Part 6: Evaluation criteria for voids in soldered joints of BGA and LGA and measurement method
Edition 2010-04

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 11: Measurement of melting temperature or melting temperature ranges of solder alloys
Edition 2013-06