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Technical Specification [CURRENT]

DIN CEN ISO/TS 17919 ; DIN SPEC 10793:2014-03

Microbiology of the food chain - Polymerase chain reaction (PCR) for the detection of food-borne pathogens - Detection of botulinum type A, B, E and F neurotoxin-producing clostridia (ISO/TS 17919:2013); German version CEN ISO/TS 17919:2013
Edition 2014-03

Geographic information - Spatial Data Infrastructure - Part 4: Service centric view; German version CEN/TR 15449-4:2013
Edition 2015-12

Technical Specification

DIN CEN/TS 15291

Identification card system - Guidance on design for accessible card-activated devices; German version CEN/TS 15291:2006
Edition 2006-04

Technical Specification

DIN CEN/TS 1923

Information technology - European character repertoires and their coding - 8 bit single byte coding; German version CEN/TS 1923:2003
Edition 2004-01

Technical Report [CURRENT]

DIN IEC/TR 60919-3

Performance of high-voltage direct current (HVDC) systems with line-commutated converters - Part 3: Dynamic conditions (IEC TR 60919-3:2009 + A1:2016 + A2:2021)
Edition 2023-05

Technical Specification [CURRENT]

DIN CEN/TS 17275 ; DIN SPEC 19284:2019-03

Nanotechnologies - Guidelines for the management and disposal of waste from the manufacturing and processing of manufactured nano-objects; German version CEN/TS 17275:2018
Edition 2019-03

Technical rule [CURRENT]

DIN SPEC 19756

Activities relating to drinking water and wastewater services - Guidelines for the management of wastewater utilities and for the assessment of wastewater services
Edition 2012-03

Technical Report [CURRENT]

DIN/TR 18224

Documentation of the verification of stability for steel constructions
Edition 2024-03

Technical Specification

DIN CEN/TS 17288

Health informatics - The International Patient Summary - Guideline for European Implementation; German version CEN/TS 17288:2020
Edition 2020-08

Technical Specification [CURRENT]

DIN IEC/TS 62647-2 ; DIN SPEC 42647-2:2013-09

Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 2: Mitigation of deleterious effects of tin (IEC/TS 62647-2:2012)
Edition 2013-09

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