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EIA SSB-1-C
Guidelines for Using Plastic Encapsulated Microcircuits and Semiconductors in Military, Aerospace and Other Rugged Applications
Edition
2000-08
SN EN 60191-6-17
Mechanical standardization of semiconductor devices - Part 6-17: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for stacked packages - Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array (P-PFBGA and P-PFLGA)
Edition
2011-04
SN EN 60749-20-1
Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat
Edition
2009-06
SN EN 62047-25
Semiconductor devices - Micro-electromechanical devices - Part 25: Silicon-based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area
Edition
2016-11
SN EN 62047-11
Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems
Edition
2013-09
SN EN 61788-18
Superconductivity - Part 18: Mechanical properties measurement - Room temperature tensile test of Ag- and/or Ag alloy-sheathed Bi-2223 and Bi-2212 composite superconductors
Edition
2013-12
SN EN 61788-3
Superconductivity. Part 3: Critical current measurement - DC critical current of Ag- and/or Ag alloy-sheathed Bi-2212 and Bi-2223 oxide superconductors
Edition
2006-08
SN EN 60947-4-3
Low-voltage switchgear and controlgear - Part 4-3: Contactors and motor-starters - AC semiconductor controllers and contactors for non-motor loads
Edition
2014-06
ISO 17279-1
Welding - Micro joining of 2nd generation high temperature superconductors - Part 1: General requirements for the procedure
Edition
2018-09
ISO 17279-3
Welding - Micro joining of second generation high temperature superconductors - Part 3: Test methods for joints
Edition
2021-02