Mechanical standardization of semiconductor devices - Part 6-17: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for stacked packages - Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array (P-PFBGA and P-PFLGA)
Edition 2011-04

Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat
Edition 2009-06

Semiconductor devices - Micro-electromechanical devices - Part 25: Silicon-based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area
Edition 2016-11

Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems
Edition 2013-09

Superconductivity - Part 18: Mechanical properties measurement - Room temperature tensile test of Ag- and/or Ag alloy-sheathed Bi-2223 and Bi-2212 composite superconductors
Edition 2013-12

Superconductivity. Part 3: Critical current measurement - DC critical current of Ag- and/or Ag alloy-sheathed Bi-2212 and Bi-2223 oxide superconductors
Edition 2006-08

Low-voltage switchgear and controlgear - Part 4-3: Contactors and motor-starters - AC semiconductor controllers and contactors for non-motor loads
Edition 2014-06

Welding - Micro joining of 2nd generation high temperature superconductors - Part 1: General requirements for the procedure
Edition 2018-09

Welding - Micro joining of second generation high temperature superconductors - Part 3: Test methods for joints
Edition 2021-02