Materials for printed boards and other interconnecting structures - Part 4-19 : sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - High performance, non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
Edition 2014-03-19

Materials for printed boards and other interconnecting structures - Part 2-44 : reinforced base materials clad and unclad - Non halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
Edition 2016-09-10

Materials for printed boards and other interconnecting structures - Part 2-40 : reinforced base materials clad and unclad - High performance, modified, non-halogenated epoxide woven E-glass laminated sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
Edition 2013-08-17

Materials for printed boards and other interconnecting structures. Copper-clad laminates for flexible boards (adhesive and non-adhesive types)
Edition 2007-10-31

Paints and varnishes - Drying tests - Part 6: Print-free test
Edition 2012-06

Printed boards - Part 20: Printed circuit boards for high-brightness LEDs
Edition 2016-05

Leather - Environmental footprint - Product Category Rules (PCR) - Carbon footprints
Edition 2017-06

Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies
Edition 2017-10

Packaging - Flexible laminate and plastic tubes - Test method to determine the print adhesion
Edition 2008-08