Materials for printed boards and other interconnecting structures - Part 2-43 : reinforced base materials clad and unclad - Non halogenated epoxide cellulose paper/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
Edition 2016-09-10

Materials for printed boards and other interconnecting structures - Part 2-39 : reinforced base materials clad and unclad - High performance epoxide and non-epoxide, woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
Edition 2013-08-17

Materials for printed boards and other interconnecting structures - Part 2-30 : reinforced base materials clad and unclad - Non-halogenated epoxide modified cyanate ester woven glass laminate sheets of defined flammability (vertical burning test), copper-clad
Edition 2013-08-17

Materials for printed boards and other interconnecting structures - Part 2-27 : reinforced base materials clad and unclad - Bismaleimide/triazine modified with non-halogenated epoxide woven glass laminate sheets of defined flammability (vertical burning test), copper-clad
Edition 2013-08-17

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-721 : test methods for materials for interconnection structures - Measurement of relative permittivity and loss tangent for copper clad laminate at microwave frequency using split post dielectric resonator
Edition 2015-10-09

Performance guide for single- and double-sided flexible printed wiring boards
Edition 2007-06-29

Materials for printed boards and other interconnecting structures - Part 2-47: Reinforced base materials clad and unclad - Non-halogenated epoxide non woven/woven E-glass reinforced laminate sheets of thermal conductivity (2.0W/m.K) and defined flammability (vertical burning test), copper-clad for lead free assembly
Edition 2018-03-23

Materials for printed boards and other interconnecting structures - Part 2-45 : reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity (1.0W/m.K) and defined flammability (vertical burning test), copper-clad for lead-free assembly
Edition 2018-03-23

Materials for printed boards and other interconnecting structures - Part 2-46 : reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity (1.5W/m K) and defined flammability (vertical burning test), copper-clad for lead-free assembly
Edition 2018-03-23

Connectors with assessed quality for use in D.C., low-frequency analogue and in digital high speed data applications. Part 4: printed board connectors. Section 102 : detail specification for two-part single-pole connectors, for multiple uses on plug-in units, with pre-centring, coding and early mating features, having a metric grid in accordance with IEC 60917
Edition 1998-06-01