Search results
Search list
Results in:
SN EN 62047-17
Semiconductor devices - Micro-electromechanical devices - Part 17: Bulge test method for measuring mechanical properties of thin films
Edition
2015-07
SN EN 62047-15
Semiconductor devices - Micro-electromechanical devices - Part 15: Test method of bonding strength between PDMS and glass
Edition
2015-07
SN EN 62047-16
Semiconductor devices - Micro-electromechanical devices - Part 16: Test methods for determining residual stresses of MEMS films; wafer curvature and cantilever beam deflection methods
Edition
2015-07
SN EN 62047-3
Semiconductor devices - Micro-electromechanical devices. Part 3: Thin film standard test piece for tensile-testing
Edition
2006-09
SN EN 62047-2
Semiconductor devices - Micro-electromechanical devices. Part 2: Tensile testing methods of thin film materials
Edition
2006-09
SN EN 60749-27
Semiconductor devices - Mechanical and climatic test methods. Part 27: Electrostatic discharge (ESD) sensitivity testing - Machine model (MM)
Edition
2006-08
SN EN 62047-6
Semiconductor devices - Micro-electromechanical devices - Part 6: Axial fatigue testing methods of thin film materials
Edition
2010-03
SN EN 60191-6-19
Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage
Edition
2010-05
SN EN 60146-1-1
Semiconductor converters - General requirements and line commutated converters - Part 1-1: Specification of basic requirements
Edition
2010-07
SN EN 62374-1+CORR
Semiconductor devices - Part 1: Time-dependent dielectric breakdown (TDDB) test for inter-metal layers
Edition
2011-04