Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 1: general test methods and methodology
Edition 2002-06-01

Detail specification : two-part connectors for printed board for high number of contacts with basic grid of 2,54 mm on 3 or 4 rows
Edition 2002-12-01

Printed board assemblies - Part 6: evaluation criteria for voids in soldered joints of BGA and LGA and measurement method
Edition 2010-07-01

Quality assessment systems - Part 3: selection and use of sampling plans for printed board and laminate end-product and in-process auditing
Edition 2013-08-24

Environmental testing - Part 2-69 : tests - Test Te/Tc : solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
Edition 2017-08-05

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 11: measurement of melting temperature or melting temperature ranges of solder alloys
Edition 2013-11-02

Printed board assemblies - Part 1: generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
Edition 2018-11-02

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-808: Thermal resistance of an assembly by thermal transient method
Edition 2024-05-31

Plastics - Carbon and environmental footprint of biobased plastics - Part 1: General principles (ISO 22526-1:2020)
Edition 2022-09-07

Postal Services - Parcel Delivery Environmental Footprint - Methodology for calculation and declaration of GHG emissions and air pollutants of parcel logistics delivery services
Edition 2023-10