Fibre optic interconnecting devices and passive components - Basic test and measurement procedures - Part 2-47: Tests - Thermal shocks (IEC 61300-2-47:2016); German version EN 61300-2-47:2016
Edition 2017-06

Specifications for particular types of winding wires - Part 67: Polyvinyl acetal enamelled rectangular aluminium wire, class 105 (IEC 60317-67:2017); German version EN 60317-67:2017
Edition 2017-11

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-807: Test methods for materials for interconnection structures - Decomposition temperature (Td) using TGA (IEC 61189-2-807:2021); German version EN IEC 61189-2-807:2021
Edition 2023-01

Specifications for particular types of winding wires - Part 33: Glass fibre wound, resin or varnish impregnated, bare or enamelled rectangular copper wire, temperature index 200 (IEC 60317-33:2015); German version EN 60317-33:2016
Edition 2016-08

Multimedia home network configuration - Basic Reference model - Part 1: System model (IEC 62608-1:2014); German version EN 62608-1:2014
Edition 2016-08

Fibre optic interconnecting devices and passive components - Basic test and measurement procedures - Part 2-28: Tests - Industrial atmosphere (sulphur dioxide) (IEC 61300-2-28:2013); German version EN 61300-2-28:2013
Edition 2014-05

Specifications for particular types of winding wires - Part 28: Polyesterimide enamelled rectangular copper wire, class 180 (IEC 60317-28:2013); German version EN 60317-28:2014
Edition 2014-10

Fibre optic interconnecting devices and passive components - Basic test and measurement procedures - Part 3-52: Examinations and measurements - Guide hole and alignment pin deformation constant, CD for 8 degree angled PC rectangular ferrule, single mode fibres (IEC 61300-3-52:2014); German version EN 61300-3-52:2014
Edition 2014-12

Specifications for particular types of winding wires - Part 51: Solderable polyurethane enamelled round copper wire, class 180 (IEC 60317-51:2014); German version EN 60317-51:2014
Edition 2014-12

Semiconductor devices - Mechanical and climatic test methods - Part 42: Temperature and humidity storage (IEC 60749-42:2014); German version EN 60749-42:2014
Edition 2015-05