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NF T51-798-2 ; NF EN ISO 22526-2:2021-11-10
Plastics - Carbon and environmental footprint of biobased plastics - Part 2: material carbon footprint, amount (mass) of CO<(Index)2> removed from the air and incorporated into polymer molecule
Edition
2021-11-10
Rapid Technologien
Verfahrens- und Werkstoffmanagement
Edition
2016-09
SN EN ISO 9117-6
Paints and varnishes - Drying tests - Part 6: Print-free test (ISO 9117-6:2012)
Edition
2012-09
EIA RS-161
Ceramic Based Printed Circuits, Unit Standards for
Edition
1956-08
EIA RS-162
Ceramic Based Printed Circuits, Test Standards for
Edition
1956-08
UNE-EN 60249-2-17
BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION no. 17: THIN POLYIMIDE WOVEN GLASS FABRIC COPPER-CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY FOR USE IN THE FABRICATION OF MULTILAYER PRINTED BOARD.
Edition
1997-08-11
UNE-EN 60249-2-19
BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION no. 19: THIN BISMALEIMIDE/TRIAZINE MODIFIED EPOXIDE WOVEN GLASS FABRIC COPPER-CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY FOR USE IN THE FABRICATION OF MULTILAYER PRINTED BOARDS.
Edition
1997-08-11
UNE-EN 60603-3
CONNECTORS FOR FREQUENCIES BELOW 3 MHZ FOR USE WITH PRINTED BOARDS. PART 3:TWO-PART CONNECTORS FOR PRINTED BOARDS HAVING CONTACTS SPACED AT 2,54 MM (0,100 IN) CENTRES AND STAGGERED TERMINATIONS AT THAT SAME SPACING.
Edition
1999-07-28
UNE-EN 60603-4
CONNECTORS FOR FREQUENCIES BELOW 3 MHZ FOR USE WITH PRINTED BOARDS. PART 4: TWO-PART CONNECTORS FOR PRINTED BOARDS HAVING CONTACT SPACED AT1,91 MM (0,075 IN) CENTRES AND STAGGED TERMINATIONS AT THAT SAME SPACING.
Edition
1999-07-28
UNE-EN 60249-2-19/A2
BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION no. 19: THIN BISMALEIMIDE/TRIAZINE MODIFIED EPOXIDE WOVEN GLASS FABRIC COPPER-CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY FOR USE IN THE FABRICATION OF MULTILAYER PRINTED BOARDS.
Edition
1997-10-17