Plastics - Carbon and environmental footprint of biobased plastics - Part 2: material carbon footprint, amount (mass) of CO<(Index)2> removed from the air and incorporated into polymer molecule
Edition 2021-11-10

Paints and varnishes - Drying tests - Part 6: Print-free test (ISO 9117-6:2012)
Edition 2012-09

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION no. 17: THIN POLYIMIDE WOVEN GLASS FABRIC COPPER-CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY FOR USE IN THE FABRICATION OF MULTILAYER PRINTED BOARD.
Edition 1997-08-11

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION no. 19: THIN BISMALEIMIDE/TRIAZINE MODIFIED EPOXIDE WOVEN GLASS FABRIC COPPER-CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY FOR USE IN THE FABRICATION OF MULTILAYER PRINTED BOARDS.
Edition 1997-08-11

CONNECTORS FOR FREQUENCIES BELOW 3 MHZ FOR USE WITH PRINTED BOARDS. PART 3:TWO-PART CONNECTORS FOR PRINTED BOARDS HAVING CONTACTS SPACED AT 2,54 MM (0,100 IN) CENTRES AND STAGGERED TERMINATIONS AT THAT SAME SPACING.
Edition 1999-07-28

CONNECTORS FOR FREQUENCIES BELOW 3 MHZ FOR USE WITH PRINTED BOARDS. PART 4: TWO-PART CONNECTORS FOR PRINTED BOARDS HAVING CONTACT SPACED AT1,91 MM (0,075 IN) CENTRES AND STAGGED TERMINATIONS AT THAT SAME SPACING.
Edition 1999-07-28

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION no. 19: THIN BISMALEIMIDE/TRIAZINE MODIFIED EPOXIDE WOVEN GLASS FABRIC COPPER-CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY FOR USE IN THE FABRICATION OF MULTILAYER PRINTED BOARDS.
Edition 1997-10-17