Base materials for printed circuits - Part 2-12: Specifications: thin epoxide woven glass fabric copper-clad laminated sheet of defined flammability, for use in the fabrication of multilayer printed boards.
Edition 2001-12-31

Base materials for printed circuits - Part 2: Specifications - Specification No. 17: Thin polyimide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards.
Edition 2001-12-31

Connectors for frequencies below 3 MHz for use with printed boards - Part 8: Two-part connectors for printed boards, for basic grid of 2,54 mm (0,1 in), with square male contacts of 0,63 mm x 0,63 mm.
Edition 2001-09-21

Materials for printed boards and other interconnecting structures - Part 6-3 : sectional specification set for reinforcement materials - Specification for finished fabric woven from "E" glass for printed boards
Edition 2023-08-04

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-803: Test methods for Z-axis expansion of base materials and printed boards
Edition 2023-09-08

Printed boards and printed board assemblies - Design and use - Part 6-4 : land pattern design - Generic requirements for dimensional drawings of surface mounted components (SMD) from the viewpoint of land pattern design
Edition 2019-07-05

Materials for printed boards and other interconnecting structures - Part 3-4 : sectional specification set for unreinforced base materials, clad and unclad (intented for flexible printed boards) - Adhesive coated flexible polyimide film
Edition 2002-01-01

Materials for printed boards and other interconnecting structures - Part 3-5 : sectional specification set for unreinforced base materials, clad and unclad (intented for flexible printed boards) - Transfer adhesive films
Edition 2002-01-01

Connectors for electronic equipment - Part 4-100 : printed board connectors with assessed quality - Detail specification for two-part connector modules having a grid of 2,5 mm for printed boards and backplanes
Edition 2002-08-01

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3 : general test methods for materials and assemblies - Soldering paste for printed board assemblies
Edition 2015-06-13