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NF C96-022-28 ; NF EN IEC 60749-28:2022-04-08
Semiconductor devices - Mechanical and climatic test methods - Part 28: Electrostatic discharge (ESD) sensitivity testing - Charged device model (CDM) - device level
Edition
2022-04-08
NF C93-801-1/A1 ; NF EN 62007-1/A1:2022-10-28
Semiconductor optoelectronic devices for fibre optic system applications - Part 1: Specification template for essential ratings and characteristics
Edition
2022-10-28
NF A87-040-2 ; NF EN ISO 17279-2:2018-11-21
Welding - Micro joining of 2nd generation high temperature superconductors - Part 2: qualification for welding and testing personnel
Edition
2018-11-21
NF C96-022-28 ; NF EN 60749-28:2017-06-30
Semiconductor devices - Mechanical and climatic test methods - Part 28: Electrostatic discharge (ESD) sensitivity testing - Charged device model (CDM) - device level
Edition
2017-06-30
SN EN 62374-1
Semiconductor devices - Part 1: Time-dependent dielectric breakdown (TDDB) test for inter-metal layers
Edition
2010-11
NF C96-022-4 ; NF EN 60749-4:2017-06-16
Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp Heat, steady state, highly accelerated stress test (HAST)
Edition
2017-06-16
NF C96-022-5 ; NF EN 60749-5:2017-07-07
Semiconductor devices - Mechanical and climatic test methods - Part 5: steady-state temperature humidity bias life test
Edition
2017-07-07
NF C31-888-4 ; NF EN IEC 61788-4:2020-05-15
Superconductivity - Part 4: residual resistance ratio measurement - Residual resistance ratio of Nb-Ti and Nb3Sn composite superconductors
Edition
2020-05-15
NF C96-022-11 ; NF EN 60749-11:2002-12-01
Semiconductor devices - Mechanical and climatic test methods - Part 11: rapid change of temperature - Two-fluid-bath method
Edition
2002-12-01
NF C96-022-31 ; NF EN 60749-31:2003-11-01
Semiconductor devices - Mechanical and climatic test methods - Part 31: flammability of plastic-encapsulated devices (internally induced)
Edition
2003-11-01