Search results

Search list

Results in:

3,151-3,160 of 3,490 results

Environmental statements and programmes for products - Mutual recognition of environmental product declarations (EPDs) and footprint communication programmes
Edition 2022-05-18

Plastics - Carbon and environmental footprint of biobased plastics - Part 1: general principles
Edition 2021-11-10

Greenhouse gases - Carbon footprint of products - Requirements and guidelines for quantification
Edition 2018-09-26

Environmental labels and declarations - Principles, requirements and guidelines for communication of footprint information
Edition 2018-10-10

Technical rule [CURRENT]

EIA CB-2

Contamination of Printed Wiring Boards
Edition 1959-06

Standards [CURRENT]

UNE-EN 62326-4-1

PRINTED BOARDS. PART 4: RIGID MULTILAYER PRINTED BOARDS WITH INTERLAYER CONNECTIONS - SECTIONAL SPECIFICATION. SECTION 1: CAPABILITY DETAIL SPECIFICATION - PERFORMANCE LEVELS A, B, AND C
Edition 1999-03-24

Standards [CURRENT]

UNE-EN 61249-3-3

Materials for printed boards and other interconnecting structures - Part 3-3: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Adhesive coated flexible polyester film.
Edition 2000-12-04

Standards [CURRENT]

UNE-EN 60249-2-11/A4

Base materials for printed circuits - Part 2: Specifications - Specification No. 11: Thin epoxide woven glass fabric copper-clad laminated sheet, general purpose grade, for use in the fabrication of multilayer printed boards.
Edition 2001-12-31

Standards [CURRENT]

UNE-EN 60249-2-12/A4

Base materials for printed circuits - Part 2-12: Specifications: thin epoxide woven glass fabric copper-clad laminated sheet of defined flammability, for use in the fabrication of multilayer printed boards.
Edition 2001-12-31

Standards [CURRENT]

UNE-EN 60249-2-17/A3

Base materials for printed circuits - Part 2: Specifications - Specification No. 17: Thin polyimide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards.
Edition 2001-12-31

TOP