Search results
Search list
Results in:
XP X30-322 ; XP ISO/TS 14029:2022-05-18
Environmental statements and programmes for products - Mutual recognition of environmental product declarations (EPDs) and footprint communication programmes
Edition
2022-05-18
NF T51-798-1 ; NF EN ISO 22526-1:2021-11-10
Plastics - Carbon and environmental footprint of biobased plastics - Part 1: general principles
Edition
2021-11-10
NF X30-367 ; NF EN ISO 14067:2018-09-26
Greenhouse gases - Carbon footprint of products - Requirements and guidelines for quantification
Edition
2018-09-26
NF X30-326 ; NF EN ISO 14026:2018-10-10
Environmental labels and declarations - Principles, requirements and guidelines for communication of footprint information
Edition
2018-10-10
EIA CB-2
Contamination of Printed Wiring Boards
Edition
1959-06
UNE-EN 62326-4-1
PRINTED BOARDS. PART 4: RIGID MULTILAYER PRINTED BOARDS WITH INTERLAYER CONNECTIONS - SECTIONAL SPECIFICATION. SECTION 1: CAPABILITY DETAIL SPECIFICATION - PERFORMANCE LEVELS A, B, AND C
Edition
1999-03-24
UNE-EN 61249-3-3
Materials for printed boards and other interconnecting structures - Part 3-3: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Adhesive coated flexible polyester film.
Edition
2000-12-04
UNE-EN 60249-2-11/A4
Base materials for printed circuits - Part 2: Specifications - Specification No. 11: Thin epoxide woven glass fabric copper-clad laminated sheet, general purpose grade, for use in the fabrication of multilayer printed boards.
Edition
2001-12-31
UNE-EN 60249-2-12/A4
Base materials for printed circuits - Part 2-12: Specifications: thin epoxide woven glass fabric copper-clad laminated sheet of defined flammability, for use in the fabrication of multilayer printed boards.
Edition
2001-12-31
UNE-EN 60249-2-17/A3
Base materials for printed circuits - Part 2: Specifications - Specification No. 17: Thin polyimide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards.
Edition
2001-12-31