Bituminous mixtures; Test methods - Part 48: Interlayer Bonding
Edition 2023-04

Structural adhesives - Guidelines for the surface preparation of metals and plastics prior to adhesive bonding
Edition 2012-02

Fine ceramics (advanced ceramics, advanced technical ceramics) - Test method for interfacial bond strength of ceramic materials
Edition 2011-05

Petroleum and natural gas industries - Design and operation of subsea production systems - Part 2: Unbonded flexible pipe systems for subsea and marine applications (ISO 13628-2:2006 + Cor 1:2009) (consolidated version)
Edition 2009-11-01

Petroleum and natural gas industries - Design and operation of subsea production systems - Part 2: Unbonded flexible pipe systems for subsea and marine applications (ISO 13628-2:2006)
Edition 2006-11

BS EN IEC 60317-38 AMD1. Specifications for particular types of winding wires. Part 38. Polyester or polyesterimide overcoated with polyamide-imide, enamelled round copper wire, class 200, with a bonding layer
Edition 2023-07-03

Specifications for particular types of winding wires - Part 38: Polyester or polyesterimide overcoated with polyamide-imide, enamelled round copper wire, class 200, with a bonding layer (IEC 55/1992/CDV) (Amendment) (english version)
Edition 2023-09-15

BS ISO 4586-3. High-pressure decorative laminates (HPL, HPDL). Sheets based on thermosetting resins (Usually called Laminates). Part 3. Classification and specifications for laminates less than 2 mm thick and intended for bonding to supporting substrates
Edition 2017-02-21

BS ISO 4586-3. High-pressure decorative laminates (HPL, HPDL). Sheets based on thermosetting resins (Usually called Laminates). Part 3. Classification and specifications for laminates less than 2 mm thick and intended for bonding to supporting substrates
Edition 2015-03-12

BS ISO 4586-5. High-pressure decorative laminates (HPL, HPDL). Sheets based on thermosetting resins (Usually called Laminates). Part 5. Classification and specifications for flooring grade laminates less than 2 mm thick intended for bonding to supporting substrates
Edition 2015-03-12