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NF C96-017 ; NF EN 62374:2008-01-01
Semiconductor devices - Time Dependent Dielectric Breakdown (TDDB) test for gate dielectric films
Edition
2008-01-01
NF C96-022-36 ; NF EN 60749-36:2003-08-01
Semiconductor devices - Mechanical and climatic test methods - Part 36: acceleration steady state
Edition
2003-08-01
NF C96-022-19 ; NF EN 60749-19:2003-08-01
Semiconductor devices - Mechanical and climatic test methods - Part 19: die shear strength
Edition
2003-08-01
NF C96-022-6 ; NF EN 60749-6:2017-06-16
Semiconductor devices - Mechanical and climatic test methods - Part 6: storage at high temperature
Edition
2017-06-16
NF C96-022-9 ; NF EN 60749-9:2017-06-16
Semiconductor devices - Mechanical and climatic test methods - Part 9: permanence of marking
Edition
2017-06-16
NF C96-013-3 ; NF EN 60191-3:2000-09-01
Mechnical standardization of semiconductor devices - Part 3: general rules for the preparation of outline drawings of integrated circuits
Edition
2000-09-01
NF C96-005-5 ; NF EN IEC 60747-5-5:2020-09-11
Semiconductor devices - Part 5-5 : optoelectronic devices - Photocouplers
Edition
2020-09-11
NF C96-435-9 ; NF EN IEC 62435-9:2021-10-01
Electronic components - Long-term storage of electronic semiconductor devices - Part 9: special cases
Edition
2021-10-01
NF C96-022-2 ; NF EN 60749-2:2002-12-01
Semiconductor devices - Mechanical and climatic test methods - Part 2: low air pressure
Edition
2002-12-01
NF C96-022-16 ; NF EN 60749-16:2003-07-01
Semiconductor devices - Mechanical and climatic test methods - Part 16: particle impact noise dectection (PIND)
Edition
2003-07-01
