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UNE-EN 60749-19/A1
Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength
Edition
2011-01-19
UNE-EN 60749-23/A1
Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life
Edition
2011-12-21
UNE-EN 13604
Copper and copper alloys - Semiconductor devices, electronic and vacuum products made from high conductivity copper
Edition
2014-07-16
NF C96-016-8 ; NF EN IEC 60747-16-8:2023-01-13
Semiconductor devices - Part 16-8 : microwave integrated circuits - Limiters
Edition
2023-01-13
NF C96-016-7 ; NF EN IEC 60747-16-7:2023-01-13
Semiconductor devices - Part 16-7 : microwave integrated circuits - Attenuators
Edition
2023-01-13
NF C96-287-2 ; NF EN IEC 63287-2:2023-05-12
Semiconductor devices - Guidelines for reliability qualification plans - Part 2: concept of mission profile
Edition
2023-05-12
NF C96-022-10 ; NF EN IEC 60749-10:2022-06-10
Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock - Device and subassembly
Edition
2022-06-10
NF C96-022-37 ; NF EN IEC 60749-37:2022-11-18
Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer
Edition
2022-11-18
NF A87-040-3 ; NF EN ISO 17279-3:2021-03-10
Welding - Micro joining of second generation high temperature superconductors - Part 3: test methods for joints
Edition
2021-03-10
NF A87-040-1 ; NF EN ISO 17279-1:2018-11-07
Welding - Micro joining of 2nd generation high temperature superconductors - Part 1: general requirements for the procedure
Edition
2018-11-07