Materials for printed boards and other interconnecting structures - Part 2-27: Reinforced base materials clad and unclad - Bismaleimide/triazine modified with non-halogenated epoxide woven glass laminate sheets of defined flammability (vertical burning test), copper-clad (Endorsed by AENOR in May of 2013.)
Edition 2013-05-01

Materials for printed boards and other interconnecting structures - Part 2-40: Reinforced base materials clad and unclad - High performance, non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly (Endorsed by AENOR in May of 2013.)
Edition 2013-05-01

Materials for printed boards and other interconnecting structures - Part 2-39: Reinforced base materials clad and unclad - High performance epoxide and non-epoxide, woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly (Endorsed by AENOR in May of 2013.)
Edition 2013-05-01

Materials for printed boards and other interconnecting structures - Part 4-18: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - High performance epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly (Endorsed by AENOR in February of 2014.)
Edition 2014-02-01

Materials for printed boards and other interconnecting structures - Part 4-19: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Hich performance non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly (Endorsed by AENOR in February of 2014.)
Edition 2014-02-01

Materials for printed boards and other interconnecting structures. Reinforced base materials clad and unclad. Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 2,0 W/(m K) and defined flammability (vertical burning test), copper-clad for lead-free assembly
Edition 2018-04-18

Materials for printed boards and other interconnecting structures. Reinforced base materials clad and unclad. Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity (1.0W/m K) and defined flammability (vertical burning test), copper-clad for lead-free assembly
Edition 2018-04-13

Materials for printed boards and other interconnecting structures. Reinforced base materials clad and unclad. Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity (1.5W/m K) and defined flammability (vertical burning test), copper-clad for lead-free assembly
Edition 2018-04-16

Connectors with assessed quality, for use in d.c., low-frequency analogue and in digital high speed data applications. Printed board connectors. Detail specification for two-part single-pole connectors, for multiple uses on plug-in units, with pre-centring, coding and early mating features, having a metric grid in accordance with IEC 60917
Edition 1997-10-15

Connectors for electronic equipment - Printed board connectors with assessed quality - Detail specification for cable-to-board connectors, with a modular pitch of 25 mm and integrated shielding function, applicable for transverse packing density of 15 mm, having a basic grid of 2,5 mm in accordance with IEC 60917-1
Edition 2003-06-02