Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat (Endorsed by Asociación Española de Normalización in November of 2020.)
Edition 2020-11-01

Envelope and Mounting Dimensions for Encapsulated Transformers and Inductors (Using Cores Listed in Table I of EIA Standard RS-217-A) R(1982)
Edition 1965

Fixed Tantalum Capacitors with Solid Electrolyte and Porous Anode with Wire Lead Terminals Rectangular, Subminiature, Non-Hermetically Sealed, Plastic Encapsulated, Polarized Insulated, Axial Lead
Edition 1987

Fixed Tantalum Capacitors with Solid Electrolyte and Porous Anode with Wire Lead Terminals Rectangular, Subminiature, Non-Hermetically Sealed, Plastic Encapsulated, Polarized, Insulated, Radial Lead
Edition 1987-05

Packaging of components for automatic handling - Part 4: stick magazines for electronic components encapsulated in packages of different forms
Edition 2014-04-19

Semiconductor devices - Mechanical and climatic test methods - Part 20: resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
Edition 2020-10-09

Packaging of components for automatic handling - Part 4: Stick magazines for electronic components encapsulated in packages of different forms
Edition 2013-11

Multilayer (Monolithic), Unencapsulated, Ceramic Dielectric, Surface-Mount Low Inductance Chip Capacitors and Multi-Terminal Low Inductance Capacitors
Edition 2022-08