Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-501: Test methods for materials for interconnection structures - Measurement of resilience strength and resilience strength retention factor of flexible dielectric materials (IEC 61189-2-501:2022); German version EN IEC 61189-2-501:2022
Edition 2023-12

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-630: Test methods for materials for interconnection structures - Moisture absorption after pressure vessel conditioning (IEC 61189-2-630:2018); German version EN IEC 61189-2-630:2018
Edition 2019-03

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-719: Test methods for materials for interconnection structures - Relative permittivity and loss tangent (500 MHz to 10 GHz) (IEC 61189-2-719:2016); German version EN 61189-2-719:2016
Edition 2017-04

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-720: Detection of defects in interconnection structures by measurement of capacitance (IEC 91/1786/CD:2022); Text in German and English
Edition 2022-09

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-721: Test methods for materials for interconnection structures - Measurement of relative permittivity and loss tangent for copper clad laminate at microwave frequency using split post dielectric resonator (IEC 61189-2-721:2015); German version EN 61189-2-721:2015
Edition 2016-03

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-801: Thermal conductivity test for base materials (IEC 61189-2-801:2023); German version EN IEC 61189-2-801:2023
Edition 2024-08

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-801: Thermal conductivity test for base materials (IEC 91/1543/CD:2018); Text in German and English
Edition 2019-04

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-803: Test methods for Z-axis expansion of base materials and printed boards (IEC 61189-2-803:2023); German version EN IEC 61189-2-803:2023
Edition 2024-08

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-803: Test methods for Z-Axis Expansion of base materials and printed board (IEC 91/1545/CD:2018); Text in German and English
Edition 2019-05

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-804: Test methods for time to delamination - T260, T288, T300 (IEC 91/1546/CD:2018); Text in German and English
Edition 2019-05