Dependability management - Part 3-12: Application guide - Integrated logistic support (IEC 60300-3-12:2011); German version EN 60300-3-12:2011
Edition 2011-08

Connectors for electronic equipment - Tests and measurements - Part 23-2: Screening and filtering tests - Test 23b: Suppression characteristics of integral filters (IEC 60512-23-2:2010); German version EN 60512-23-2:2010
Edition 2011-06

Connectors for frequencies below 3 MHz for use with printed boards - Part 12: Detail specification for dimensions, general requirements and tests for a range of sockets designed for use with integrated cicuits (IEC 60603-12:1992); German version EN 60603-12:1998
Edition 1998-07

Discrete semiconductor devices and integrated circuits - Part 5-2: Optoelectronic devices; Essential ratings and characteristics (IEC 60747-5-2:1997 + A1:2002); German version EN 60747-5-2:2001 + A1:2002
Edition 2003-01

Discrete semiconductor devices and integrated circuits - Part 5-3: Optoelectronic devices; Measuring methods (IEC 60747-5-3:1997 + A1:2002); German version EN 60747-5-3:2001 + A1:2002
Edition 2003-01

Semiconductor devices - Part 16-1: Microwave integrated circuits - Amplifiers (IEC 60747-16-1:2001 - A1:2007 - A2:2017); German version EN 60747-16-1:2002 + A1:2007 + A2:2017
Edition 2017-10

Semiconductor devices - Part 16-3: Microwave integrated circuits - Frequency converters (IEC 60747-16-3:2002 + A1:2009 + A2:2017); German version EN 60747-16-3:2002 + A1:2009 + A2:2017
Edition 2018-04

Semiconductor devices - Part 16-4: Microwave integrated circuits - Switches (IEC 60747-16-4:2004 + A1:2009 + A2:2017); German version EN 60747-16-4:2004 + A1:2011 + A2:2017
Edition 2018-04

Semiconductor devices - Part 16-5: Microwave integrated circuits - Oscillators (IEC 60747-16-5:2013 + A1:2020 + COR1:2020); German version EN 60747-16-5:2013 + A1:2020
Edition 2021-08

Semiconductor devices - Part 16-6: Microwave integrated circuits - Frequency multipliers (IEC 60747-16-6:2019); German version EN IEC 60747-16-6:2019
Edition 2021-08