Electric components - Reliability - Reference conditions for failure rates and stress models for conversion (IEC 61709:2011); German version EN 61709:2011
Edition 2012-01

Semiconductor devices - Part 15: Discrete devices - Isolated power semiconductor devices (IEC 47E/812/CDV:2023); German and English version prEN IEC 60747-15:2023
Edition 2024-06

Semiconductor devices - Mechanical and climatic test methods - Part 18: Ionizing radiation (total dose) (IEC 60749-18:2019); German version EN IEC 60749-18:2019
Edition 2020-02

Entertainment technology - Stage Lighting Systems - Part 1: Dimmer - Definitions, requirements and user information
Edition 2017-09

Semiconductor devices - Mechanical and climatic test methods - Part 34-1: Power cycling test for power semiconductor module (IEC 47/2759/CD:2022); Text in German and English
Edition 2024-08

Semiconductor devices - Part 16-6: Microwave integrated circuits - Frequency multipliers (IEC 60747-16-6:2019); German version EN IEC 60747-16-6:2019
Edition 2021-08

Space engineering - Method for the calculation of radiation received and its effects, and a policy for design margins; English version EN 16603-10-12:2014
Edition 2014-09

Graphical symbols for diagrams - Part 5: Semiconductors and electron tubes (IEC 60617-5:1996); German version EN 60617-5:1996
Edition 1997-08

Explosive atmospheres - Part 38: Equipment and components in explosive atmospheres in underground mines (ISO/IEC 80079-38:2016); German version EN ISO/IEC 80079-38:2016
Edition 2017-10

Semiconductor devices - Part 16-3: Microwave integrated circuits - Frequency converters (IEC 60747-16-3:2002 + A1:2009 + A2:2017); German version EN 60747-16-3:2002 + A1:2009 + A2:2017
Edition 2018-04