Modular taper interface with ball track system Part 2: Dimensions and designation of receivers
Edition 2018-05-17

Asphaltic binders - Determination of the softening point - Ring-and-ball method
Edition 2016-10-10

Hot melt adhesives - Determination of softening point - Ring and ball method
Edition 2020-06-11

Road vehicles - Automatic hitch and ball hitch for trucks and trailers - Requirements
Edition 2016-10-04

Ball cock faucet for building potable water reservoirs - Requirements and test methods
Edition 2015-01-14

Lubrificating oils and fluids - Determination of extreme-pressure properties by the four-ball method
Edition 2016-09-23

Fibre optic active components and devices - Package and interface standards - Part 21: Design guidelines of electrical interface of PIC packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA)
Edition 2021-06

Mechanical standardization of semiconductor devices. Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA)
Edition 2003-07

Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA)
Edition 2016-11

Mechanical standardization of semiconductor devices - Part 6-17: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for stacked packages - Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array (P-PFBGA and P-PFLGA)
Edition 2011-04