Connectors for frequencies below 3 MHz for use with printed boards. Detail specification for two-part connectors of assessed quality, for printed boards for basic grid of 2,54 mm (0,1 in) with free connectors for non-accessible insulation displacement terminations (ID)
Edition 1998-05-15

Connectors with assessed quality, for use in d.c., low-frequency analogue and in digital high speed data applications. Sectional specification. Printed board connectors
Edition 1997-03-15

Harmonized system of quality assessment for electronic components. Basic specification: CECC assessed process average procedure (60% confidence limit)
Edition 1988-02-29

Harmonized system of quality assessment for electronic components. Sectional specification: electromechanical all-or-nothing heavy load relays of assessed quality (rated from 5A and above)
Edition 1994-02-15

Harmonized system of quality assessment for electronic components. Blank detail specification: electromechanical all-or-nothing heavy load relays of assessed quality (hermetically sealed, 5A to 25A)
Edition 1996-02-15

Harmonized system of quality assessment for electronic components. Generic specification. Solid state all-or-nothing relays. Generic data and methods of test
Edition 1992-05-01

Harmonized system of quality assessment for electronic components. Generic specification. Sockets for use with electrical relays of assessed quality
Edition 1995-01-15

Harmonized system of quality assessment for electronic components. Sectional specification: relay sockets of assessed quality
Edition 1995-01-15

Specification for harmonized system of quality assessment for electronic components. Blank detail specification: relay sockets of assessed quality
Edition 1995-03-15

Plastics piping systems. Validated design parameters of buried thermoplastics piping systems
Edition 2018-05-04