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DIN EN IEC 60749-15
Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices (IEC 60749-15:2020); German version EN IEC 60749-15:2020
Edition
2022-05
BS EN 61191-3
Printed board assemblies. Sectional specification. Requirements for through-hole mount soldered assemblies
Edition
2017-09-25
NF C90-705 ; NF EN 61191-3:2017-09-04
Printed board assemblies - Part 3: sectional specification - Requirements for through-hole mount soldered assemblies
Edition
2017-09-04
SN EN 61191-3
Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
Edition
2017-09
IPC TR-579
Round Robin Reliability Evaluation of Small Diameter Plated Through Holes in PWBs
Edition
1988-09
BS EN 60127-4+A2
Miniature fuses - Universal modular fuse-links (UMF) - Through-hole and surface mount types
Edition
2005-11-14
DIN EN 60127-4 ; VDE 0820-4:2013-12
Miniature fuses - Part 4: Universal modular fuse-links (UMF) - Through-hole and surface mount types (IEC 60127-4:2005 + A1:2008 + A2:2012); German version EN 60127-4:2005 + A1:2009 + A2:2013
Edition
2013-12
BS EN IEC 61760-3
Surface mounting technology. Standard method for the specification of components for through-hole reflow (THR) soldering
Edition
2021-03-18
BS EN IEC 60749-15
Semiconductor devices. Mechanical and climatic test methods. Resistance to soldering temperature for through-hole mounted devices
Edition
2020-10-01
NF C90-710-3 ; NF EN IEC 61760-3:2021-03-12
Surface mounting technology - Part 3: standard method for the specification of components for through-hole reflow (THR) soldering
Edition
2021-03-12
