Materials for printed boards and other interconnecting structures - Part 4-5: Sectional specification set for prepreg materials, unclad - Polyimide, modified or unmodified, woven E-glass prepreg of defined flammability (Endorsed by AENOR in January of 2006.)
Edition 2006-01-01

Materials for printed boards and other interconnecting structures - Part 2-1: Reinforced base materials, clad and unclad - Phenolic cellulose paper reinforced laminated sheets, economic grade, copper-clad (Endorsed by AENOR in July of 2005.)
Edition 2005-07-01

Materials for printed boards and other interconnecting structures - Part 2-2: Reinforced base materials, clad and unclad - Phenolic cellulose paper reinforced laminate sheets, high electrical grade, copper-clad (Endorsed by AENOR in July of 2005.)
Edition 2005-07-01

Materials for printed boards and other interconnecting structures - Part 2-23: Reinforced base materials, clad and unclad - Non-halogenated phenolic cellulose paper reinforced laminated sheets, economic grade, copper-clad (Endorsed by AENOR in July of 2005.)
Edition 2005-07-01

Connectors for frequencies below 3 MHz for use with printed boards - Part 14: Detail specification for circular connectors for low-frequency audio and video applications such as audio, video and audio-visual equipment. (Endorsed by AENOR in November of 2001.)
Edition 2001-11-01

Connectors for frequencies below 3 MHz for use with printed boards - Part 12: Detail specification for dimensions, general requirements and tests for a range of sockets designed for use with integrated circuits. (Endorsed by AENOR in November of 2001.)
Edition 2001-11-01

Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method (Endorsed by Asociación Española de Normalización in October of 2019.)
Edition 2019-10-01

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-807: Test methods for materials for interconnection structures - Decomposition temperature (Td) using TGA (Endorsed by Asociación Española de Normalización in November of 2021.)
Edition 2021-11-01

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-503: General test method for materials and assemblies - Conductive anodic filaments (CAF) testing of circuit boards (Endorsed by Asociación Española de Normalización in September of 2017.)
Edition 2017-09-01

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-504: General test methods for materials and assemblies - Process ionic contamination testing (PICT) (Endorsed by Asociación Española de Normalización in July of 2020.)
Edition 2020-07-01