Semiconductor devices - Mechanical and climatic test methods - Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat
Edition 2009-07-31

Conservation of cultural property - Packing principles for transport
Edition 2012-05-01

Wood. Wood fibres for packing and stuffing
Edition 1962-03-01

Aerospace series - Washers, facing/packing - Heat resisting steel
Edition 2008-10-01

Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat

Semiconductor devices - Mechanical and climatic test methods - Part 20-1 : handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat
Edition 2009-07-01

Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat
Edition 2009-06

Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat (IEC 47/2565/FDIS) (english version)
Edition 2023-11-01

Determination of dimensional characteristics of sleeping bags - Part 3: Volume under load and easiness of packing
Edition 2016-07-15

Connectors for electronic equipment - Part 4-108 : printed board connectors with assessed quality - Detail specification for cable-to-board connectors, with a modular pitch of 25 mm and integrated shielding function, applicable for transverse packing density of 15 mm, having a basic grid of 2,5 mm in accordance with IEC 60917-1
Edition 2004-06-01