Test methods for electrical materials, printed boards and other interconnection structures and assemblies. Test methods for materials for interconnection structures. Relative permittivity and loss tangent (500 MHz to 10 GHz)
Edition 2016-10-31

Materials for printed boards and other interconnecting structures. Reinforced base materials clad and unclad. Non-halogenated epoxide modified cyanate ester woven glass laminate of defined flammability (vertical burning test), copper-clad
Edition 2013-04-30

Information technology - Automatic identification and data capture techniques - Bar code print quality test specification - Two-dimensional symbols (ISO/IEC 15415:2004/Cor 1:2008); Corrigendum AC
Edition 2011-11

Materials for printed boards and other interconnecting structures - Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Epoxide woven E-glass prepreg of defined flammability
Edition 2008-07-31

Materials for printed boards and other interconnecting structures - Sectional specification set for prepreg materials, unclad Polymide, modified or unmodified, woven E-glass prepeg of defined flammability
Edition 2006-02-01

Materials for printed boards and other interconnecting structures - Sectional specification set for prepreg materials, unclad - Non-halogenated epoxide woven E-glass prepeg of defined flammability
Edition 2006-02-01

Materials for printed boards and other interconnecting structures - Sectional specification set for prepreg materials, unclad - Non-halogenated multifuctional epoxide woven E-glass prepeg of defined flammability
Edition 2006-02-01

Materials for printed boards and other interconnecting structures - Reinforced base materials, clad and unclad - Phenolic cellulose paper reinforced laminated sheets, high electrical grade, copper-clad
Edition 2006-06-30

Materials for printed boards and other interconnecting structures - Reinforced base materials, clad and unclad - Non-halogenated phenolic cellulose paper reinforced laminated sheets, economic grade, copper-clad
Edition 2005-08-25

Harmonized system of quality assessment for electronic components - Detail specification - Two-part connectors for printed boards having a grid of 2,54 mm, short version in compliance with CECC 75 101-801, with assessed quality
Edition 2004-04-27