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UNE-EN 61191-3
Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies (Endorsed by Asociación Española de Normalización in October of 2017.)
Edition
2017-10-01
UNE-EN 61193-3
Quality assessment systems - Part 3: Selection and use of sampling plans for printed board and laminate end-product and in-process auditing (Endorsed by AENOR in June of 2013.)
Edition
2013-06-01
UNE-EN 61189-11
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 11: Measurement of melting temperature or melting temperature ranges of solder alloys (Endorsed by AENOR in August of 2013.)
Edition
2013-08-01
UNE-EN 175101-802
Detail specification: Two-part connectors for printed boards for high number of contacts with basic grid of 2,54 mm on 3 or 4 rows (Endorsed by AENOR in June of 2000.)
Edition
2000-06-01
UNE-EN 175101-809
Detail specification: Two-part connectors for printed boards having a grid of 2,54 mm, short version in compliance with CECC 75 101-801, with assessed quality (Endorsed by AENOR in July of 2004.)
Edition
2004-07-01
UNE-EN 175101-809 Corrigendum
Detail specification: Two-part connectors for printed boards having a grid of 2,54 mm, short version in compliance with CECC 75 101-801, with assessed quality (Endorsed by AENOR in September of 2005.)
Edition
2005-09-01
BS EN IEC 61189-2-501
Test methods for electrical materials, printed boards and other interconnection structures and assemblies. Test methods for materials for interconnection structures. Measurement of resilience strength and resilience strength retention factor of flexible dielectric materials
Edition
2022-05-06
BS EN IEC 61189-2-807
Test methods for electrical materials, printed boards and other interconnection structures and assemblies. Test methods for materials for interconnection structures. Decomposition temperature (<i>T</i>d) using TGA
Edition
2021-11-05
BS EN 61189-2-719
Test methods for electrical materials, printed boards and other interconnection structures and assemblies. Test methods for materials for interconnection structures. Relative permittivity and loss tangent (500 MHz to 10 GHz)
Edition
2016-10-31
BS EN 61249-4-1
Materials for printed boards and other interconnecting structures - Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Epoxide woven E-glass prepreg of defined flammability
Edition
2008-07-31