Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies (Endorsed by Asociación Española de Normalización in October of 2017.)
Edition 2017-10-01

Quality assessment systems - Part 3: Selection and use of sampling plans for printed board and laminate end-product and in-process auditing (Endorsed by AENOR in June of 2013.)
Edition 2013-06-01

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 11: Measurement of melting temperature or melting temperature ranges of solder alloys (Endorsed by AENOR in August of 2013.)
Edition 2013-08-01

Detail specification: Two-part connectors for printed boards for high number of contacts with basic grid of 2,54 mm on 3 or 4 rows (Endorsed by AENOR in June of 2000.)
Edition 2000-06-01

Detail specification: Two-part connectors for printed boards having a grid of 2,54 mm, short version in compliance with CECC 75 101-801, with assessed quality (Endorsed by AENOR in July of 2004.)
Edition 2004-07-01

Detail specification: Two-part connectors for printed boards having a grid of 2,54 mm, short version in compliance with CECC 75 101-801, with assessed quality (Endorsed by AENOR in September of 2005.)
Edition 2005-09-01

Test methods for electrical materials, printed boards and other interconnection structures and assemblies. Test methods for materials for interconnection structures. Measurement of resilience strength and resilience strength retention factor of flexible dielectric materials
Edition 2022-05-06

Test methods for electrical materials, printed boards and other interconnection structures and assemblies. Test methods for materials for interconnection structures. Decomposition temperature (<i>T</i>d) using TGA
Edition 2021-11-05

Test methods for electrical materials, printed boards and other interconnection structures and assemblies. Test methods for materials for interconnection structures. Relative permittivity and loss tangent (500 MHz to 10 GHz)
Edition 2016-10-31

Materials for printed boards and other interconnecting structures - Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Epoxide woven E-glass prepreg of defined flammability
Edition 2008-07-31