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DIN EN 61188-5-4
Printed boards and printed board assemblies - Design and use - Part 5-4: Attachment (land/joint) considerations - Components with J leads on two sides (IEC 61188-5-4:2007); German version EN 61188-5-4:2007
Edition
2008-07
DIN EN 61280-2-10
Fibre optic communication subsystem test procedures - Part 2-10: Digital systems - Time-resolved chirp and alpha-factor measurement of laser transmitters (IEC 61280-2-10:2005); German version EN 61280-2-10:2005
Edition
2006-03
DIN EN 61290-3-1
Optical amplifiers - Test methods - Part 3-1: Noise figure parameters - Optical spectrum analyzer method (IEC 61290-3-1:2003); German version EN 61290-3-1:2003
Edition
2004-05
DIN EN 61754-34
Fibre optic interconnecting devices and passive components - Fibre optic connector interfaces - Part 34: Type URM connector family (IEC 61754-34:2016); German version EN 61754-34:2016
Edition
2017-07
DIN IEC 60533
Electrical and electronic installations in ships - Electromagnetic compatibility (EMC) - Ships with a metallic hull (IEC 60533:2015)
Edition
2021-05
DIN EN ISO 21009-1
Cryogenic vessels - Static vacuum-insulated vessels - Part 1: Design, fabrication, inspection and tests (ISO/DIS 21009-1:2024); German and English version prEN ISO 21009-1:2024
Edition
2024-07
DIN EN 17450-2
Fixed firefighting systems - Water mist systems - Part 2: Product characteristics and test methods for nozzles; German and English version prEN 17450-2:2023
Edition
2023-05
DIN 30655-2
Installation systems for gas installation inside buildings, consisting of multi-layer composite pipes and their corresponding fittings, for an operating pressure ≤ 100 mbar - Part 2: Conformity assessment; Text in German and English
Edition
2020-12
DIN EN IEC 60384-17
Fixed capacitors for use in electronic equipment - Part 17: Sectional specification - Fixed metallized polypropylene film dielectric AC and pulse capacitors (IEC 60384-17:2019); German version EN IEC 60384-17:2019
Edition
2019-12
DIN EN 62047-9
Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS (IEC 62047-9:2011); German version EN 62047-9:2011
Edition
2012-03