Search results
Search list
Results in:
SAE AS 6294/2
Requirements for Plastic Encapsulated Microcircuits in Military and Avionics Applications
Edition
2018-04-24
BS CECC 00808
Harmonized system of quality assessment for electronic components. Guidance document: use and application of plastic encapsulated devices
Edition
1996-08-15
BS EN 60286-4
Packaging of components for automatic handling. Stick magazines for electronic components encapsulated in packages of different forms
Edition
2013-11-30
BS EN 60749-35
Semiconductor devices - Mechanical and climatic test methods - Acoustic microscopy for plastic encapsulated electronic components
Edition
2006-11-30
UNE-EN 61857-22
Electrical insulation systems - Procedures for thermal evaluation - Part 22: Specific requirements for encapsulated-coil model - Wire-wound electrical insulation system (EIS)
Edition
2009-04-01
NF C26-310-22 ; NF EN 61857-22:2009-01-01
Electrical insulation systems - Procedures for thermal evaluation - Part 22: specific requirements for encapsulated-coil model - Wire-wound electrical insulation system (EIS)
Edition
2009-01-01
UNE-EN 60286-4
Packaging of components for automatic handling - Part 4: Stick magazines for electronic components encapsulated in packages of different forms (Endorsed by AENOR in January of 2014.)
Edition
2014-01-01
SAE SSB-1D
Guidelines for Using Plastic Encapsulated Microcircuits and Semiconductors in Military, Aerospace, and Other Rugged Applications
Edition
2020-01-14
BS EN IEC 60749-20
Semiconductor devices. Mechanical and climatic test methods. Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
Edition
2020-10-14
EIA-580AA00
Blank Detail Specification for Fixed Metallized Polyethylene-Terephthalate Film Dielectric Chip Capacitors for Direct Current - Encapsulated
Edition
1991-11-07