Requirements for Plastic Encapsulated Microcircuits in Military and Avionics Applications
Edition 2018-04-24

Harmonized system of quality assessment for electronic components. Guidance document: use and application of plastic encapsulated devices
Edition 1996-08-15

Packaging of components for automatic handling. Stick magazines for electronic components encapsulated in packages of different forms
Edition 2013-11-30

Semiconductor devices - Mechanical and climatic test methods - Acoustic microscopy for plastic encapsulated electronic components
Edition 2006-11-30

Electrical insulation systems - Procedures for thermal evaluation - Part 22: Specific requirements for encapsulated-coil model - Wire-wound electrical insulation system (EIS)
Edition 2009-04-01

Electrical insulation systems - Procedures for thermal evaluation - Part 22: specific requirements for encapsulated-coil model - Wire-wound electrical insulation system (EIS)
Edition 2009-01-01

Packaging of components for automatic handling - Part 4: Stick magazines for electronic components encapsulated in packages of different forms (Endorsed by AENOR in January of 2014.)
Edition 2014-01-01

Guidelines for Using Plastic Encapsulated Microcircuits and Semiconductors in Military, Aerospace, and Other Rugged Applications
Edition 2020-01-14

Semiconductor devices. Mechanical and climatic test methods. Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
Edition 2020-10-14

Blank Detail Specification for Fixed Metallized Polyethylene-Terephthalate Film Dielectric Chip Capacitors for Direct Current - Encapsulated
Edition 1991-11-07