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DIN EN 61248-7
Transformers and inductors for use in electronic and telecommunication equipment - Part 7: Sectional specification for high frequency inductors and intermediate frequency transformers on the basis of the capability approval procedure (IEC 61248-7:1996); German version EN 61248-7:1997
Edition
1998-05
DIN EN 4708-201
Aerospace series - Sleeves, heat-shrinkable, for binding, insulation and identification - Part 201: Polyolefin identification sleeves - Operating Temperature range -55 °C to 135 °C - Product standard; German and English version EN 4708-201:2022
Edition
2023-04
DIN EN 61191-3
Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies (IEC 61191-3:2017); German version EN 61191-3:2017
Edition
2018-05
DIN EN 61191-4
Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies (IEC 61191-4:2017); German version EN 61191-4:2017
Edition
2018-05
DIN EN 62149-1
Fibre optic active components and devices - Performance standards - Part 1: General and guidance (IEC 62149-1:2011); German version EN 62149-1:2012
Edition
2012-09
DIN EN 60191-6-17
Mechanical standardization of semiconductor devices - Part 6-17: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for stacked packages - Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and P-PFLGA) (IEC 60191-6-17:2011); German version EN 60191-6-17:2011
Edition
2011-09
DIN EN 61076-3-117
Connectors for electronic equipment - Product requirements - Part 3-117: Rectangular connectors - Detail specification for protective housings for use with 8-way shielded and unshielded connectors for industrial environments incorporating the IEC 60603-7 series interface - Variant 14 related to IEC 61076-3-106 - Push pull coupling (IEC 61076-3-117:2009); German version EN 61076-3-117:2009
Edition
2010-01
DIN EN 60749-8
Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing (IEC 60749-8:2002 + Corr. 1:2003 + Corr. 2:2003); German version EN 60749-8:2003
Edition
2003-12
DIN EN 60917-2-2
Modular order for the development of mechanical structures for electronic equipment practices - Part 2: Sectional specification; interface coordination dimensions for the 25 mm equipment practice; section 2: Detail specification; dimensions for subracks, chassis, backplanes, front panels and plug-in units (IEC 60917-2-2:1994); German version EN 60917-2-2:1996
Edition
1996-06
DIN EN 50094/A1
Access control system for the MAC/packet family: EUROCRYPT; German version EN 50094:1992/A1:1995
Edition
1995-08