Test methods for electrical materials, printed boards and other interconnection structures and assemblies. X/Y CTE test for thin base materials by TMA
Edition 2024-05-30

Printed boards and assemblies - Design and use - Attachment (land/joint) considerations - Chip carriers with J-leads on four sides
Edition 2003-06-26

Materials for printed boards and other interconnecting structures - Sectional specification set for prepreg materials, unclad - Multifunctional expoxide woven E-glass prepeg of defined flammability
Edition 2006-02-01

Standard Practice for Abrasion Resistance of Printed Matter by the GA-CAT Comprehensive Abrasion Tester
Edition 2024

Soft soldering fluxes - Test methods - Part 18: Cleanliness of soldered printed circuit assemblies before and/or after cleaning
Edition 2024-08

Electric cables - Accessories - Material characterization - Part 1: Fingerprinting for resinous compounds (Endorsed by Asociación Española de Normalización in January of 2018.)
Edition 2018-01-01

Postal Services. Parcel Delivery Environmental Footprint. Methodology for calculation and declaration of GHG emissions and air pollutants of parcel logistics delivery services
Edition 2023-09-28

Standard Guide for FT-IR Fingerprinting of a Non-Aqueous Liquid Paint as Supplied in the Manufacturer's Container
Edition 2011

Postal Services - Parcel Delivery Environmental Footprint - Methodology for calculation and declaration of GHG emissions and air pollutants of parcel logistics delivery services
Edition 2024-03-15

Standard Practice for Tread Footprints of Passenger Car Tires Groove Area Fraction and Dimensional Measurements
Edition 2023