Semiconductor devices - Micro-electromechanical devices - Part 26: Description and measurement methods for micro trench and needle structures (IEC 62047-26:2016); German version EN 62047-26:2016
Edition 2016-12

Semiconductor devices - Micro-electromechanical devices - Part 17: Bulge test method for measuring mechanical properties of thin films (IEC 62047-17:2015); German version EN 62047-17:2015
Edition 2015-12

Ophthalmic optics and instruments - Instruments to measure axial distances in the eye (ISO 22665:2012); German version EN ISO 22665:2012
Edition 2013-04

Characterization of waste - Leaching behaviour test - Influence of pH on leaching with continuous pH control; German version EN 14997:2015
Edition 2015-05

Petroleum products - Determination of boiling range distribution by gas chromatography method - Part 1: Middle distillates and lubricating base oils; German version EN 15199-1:2020
Edition 2021-02

Semiconductor devices - Measurement and evaluation methods of kinetic energy harvesting devices under practical vibration environment - Part 3: Human foot impact motion (IEC 47/2758/CD:2022); Text in German and English
Edition 2024-08

Semiconductor devices - Mechanical and climatic test methods - Part 34-1: Power cycling test for power semiconductor module (IEC 47/2759/CD:2022); Text in German and English
Edition 2024-08

Bonded Glazing for doors, windows and curtain walling - Verification of mechanical performance of bonding on aluminium and steel surfaces; German version EN 16759:2021
Edition 2021-12

Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures (IEC 62047-12:2011); German version EN 62047-12:2011
Edition 2012-06

Semiconductor devices - Mechanical and climatic test methods - Part 41: Standard reliability testing methods of non-volatile memory devices (IEC 60749-41:2020); German version EN IEC 60749-41:2020
Edition 2023-03