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EIA J-STD-035A
Acoustic Microscopy for Non-Hermetic Encapsulated Electronic Devices
Edition
2022-12
SAE AS 6294/1
Requirements for Plastic Encapsulated Microcircuits in Space Applications
Edition
2017-11-21
UNE-EN 60749-31
Semiconductor devices - Mechanical and climatic test methods - Part 31: Flammability of plastic-encapsulated devices (internally induced)
Edition
2004-03-18
UNE-EN 60749-32
Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced)
Edition
2004-03-18
UNE-EN 60749-32/A1
Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced)
Edition
2011-01-19
NF C96-022-31 ; NF EN 60749-31:2003-11-01
Semiconductor devices - Mechanical and climatic test methods - Part 31: flammability of plastic-encapsulated devices (internally induced)
Edition
2003-11-01
NF C96-022-32/A1 ; NF EN 60749-32/A1:2011-05-01
Semiconductor devices - Mechanical and climatic test methods - Part 32: flammability of plastic-encapsulated devices (externally induced)
Edition
2011-05-01
BS EN 61857-22
Electrical insulation systems - Procedures for thermal evaluation - Specific requirements for encapsulated-coil model - Wire-wound electrical insulation system (EIS)
Edition
2009-03-31
SAE AS 6294/4
Requirements for Plastic Encapsulated Semiconductor Devices in Military and Avionics Applications
Edition
2019-07-09
SAE AS 6294/3
Requirements for Plastic Encapsulated Microcircuits Discrete Semiconductors in Space Applications
Edition
2019-08-07
