Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste (IEC 60068-2-83:2011); German version EN 60068-2-83:2011
Edition 2012-07

Thermal protection and energy economy in buildings - Part 3: Protection against moisture subject to climate conditions - Requirements, calculation methods and directions for planning and construction
Edition 2024-03

Ice-sport facilities - Ice-sport facilities with artificial ice - Rules for planning and construction
Edition 2017-10

Vegetation technology in landscaping - Soil working
Edition 2018-06

Carbon brushes, brush holders, commutators and slip-rings - Definitions and nomenclature (IEC 60276:2018); German version EN IEC 60276:2019
Edition 2021-03

Piezoelectric sensors - Part 2: Chemical and biochemical sensors (IEC 63041-2:2017); German version EN IEC 63041-2:2018
Edition 2018-08

Piezoelectric sensors - Part 3: Physical sensors (IEC 63041-3:2020); German version EN IEC 63041-3:2020
Edition 2021-07

Mechanical standardization of semiconductor devices - Part 6-17: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for stacked packages - Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and P-PFLGA) (IEC 60191-6-17:2011); German version EN 60191-6-17:2011
Edition 2011-09

Optical circuit boards - Performance standard - Part 3-1: Flexible optical circuit boards using unconnectorized optical glass fibres (IEC 62496-3-1:2009); German version EN 62496-3-1:2010
Edition 2011-01

Optical amplifier - Test methods - Part 3-2: Noise figure parameters - Electrical spectrum analyzer method (IEC 61290-3-2:2008); German version EN 61290-3-2:2008
Edition 2009-06