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VDI-EE 4635 Blatt 4.1
Power-to-X - Approval procedures for Power-to-X plants
Edition
2024-08
OEVE/OENORM E 8050
Lightning protection systems - Symbols
Edition
2008-08-01
OEVE/OENORM EN 61754-15
Fibre optic interconnecting devices and passive components - Fibre optic connector interfaces - Part 15: Type LSH connector family (IEC 61754-15:2009 + Cor.:2014) (german version)
Edition
2014-07-01
OENORM EN 4658
Aerospace series - Steel FE-PM1507 (X1CrNiMoAlTi12-11-2) - Vacuum induction melted and consumable electrode remelted - Solution treated and precipitation treated - Forgings - a or D up to 200 mm - Rm 1520 MPa and above
Edition
2012-01-01
OEVE/OENORM EN 61099
Insulating liquids - Specifications for unused synthetic organic esters for electrical purposes (IEC 61099:2010) (german version)
Edition
2011-07-01
OEVE/OENORM EN 60893-3-7
Insulating materials - Industrial rigid laminated sheets based on thermosetting resins for electrical purposes - Part 3-7: Specifications for individual materials - Requirements for rigid laminated sheets based on polyimide resins (IEC 60893-3-7:2003 + A1:2009) (german version)
Edition
2010-07-01
OENORM EN ISO 520
Cereals and pulses - Determination of the mass of 1000 grains (ISO 520:2010)
Edition
2011-02-15
OEVE/OENORM EN 60191-6-17
Mechanical standardization of semiconductor devices - Part 6-17: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for stacked packages - Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and P-PFLGA) (IEC 60191-6-17:2011) (german version)
Edition
2011-10-01
OEVE/OENORM EN 60893-3-5
Insulating materials - Industrial rigid laminated sheets based on thermosetting resins for electrical purposes - Part 3-5: Specifications for individual materials - Requirements for rigid laminated sheets based on polyester resins (IEC 60893-3-5:2003 + A1:2009) (german version)
Edition
2010-05-01
OEVE/OENORM EN 60191-6
Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages (IEC 60191-6:2009) (german version)
Edition
2010-07-01