Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-2: Shear strength test (IEC 62137-1-2:2007)
Edition 2008-03-01

Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-3: Cyclic drop test (IEC 62137-1-3:2008)
Edition 2009-08-01

Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-4: Cyclic bending test (IEC 62137-1-4:2009) (german version)
Edition 2009-10-01

Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-5: Mechanical shear fatigue test (IEC 62137-1-5:2009) (german version)
Edition 2010-02-01

Electronics assembly technology - Part 3: Selection guidance of environmental and endurance test methods for solder joints (IEC 62137-3:2011) (german version)
Edition 2012-10-01

Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices (IEC 62137-4:2014) (german version)
Edition 2015-09-01

Electronics assembly technology - Electronic modules (IEC 62421:2007)
Edition 2008-07-01

Industrial-process control valves - Part 6: Mounting details for attachment of positioners to control valves - Section 1: Positioner mounting on linear actuators
Edition 1997-11-19

Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices ((IEC 60749-15:2020) EN IEC 60749-15:2020) (german version)
Edition 2022-06-01