Semiconductor devices - Mechanical and climatic test methods - Part 40: Board level drop test method using a strain gauge (IEC 60749-40:2011); German version EN 60749-40:2011
Edition 2012-02

Semiconductor devices - Mechanical and climatic test methods - Part 27: Electrostatic discharge (ESD) sensitivity testing - Machine model (MM) (IEC 60749-27:2006 + A1:2012); German version EN 60749-27:2006 + A1:2012
Edition 2013-04

Semiconductor devices - Micro-electromechanical devices - Part 4: Generic specification for MEMS (IEC 62047-4:2008); German version EN 62047-4:2010
Edition 2011-03

Semiconductor devices - Micro-electromechanical devices - Part 6: Axial fatigue testing methods of thin film materials (IEC 62047-6:2009); German version EN 62047-6:2010
Edition 2010-07

Integrated circuits - Measurement of electromagnetic immunity, 150 kHz to 1 GHz - Part 3: Bulk current injection (BCI) method (IEC 62132-3:2007); German version EN 62132-3:2007
Edition 2008-04

Semiconductor devices - Mechanical and climatic test methods - Part 38: Soft error test method for semiconductor devices with memory (IEC 60749-38:2008); German version EN 60749-38:2008
Edition 2008-10

Semiconductor devices - Mechanical and climatic test methods - Part 35: Acoustic microscopy for plastic encapsulated electronic components (IEC 60749-35:2006); German version EN 60749-35:2006
Edition 2007-03

Liquid crystal display devices - Part 3: Liquid crystal display (LCD) cells - Sectional specification (IEC 61747-3:2006); German version EN 61747-3:2006
Edition 2007-03

Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 2: Measurement of radiated emissions - TEM cell and wideband TEM cell method (IEC 61967-2:2005); German version EN 61967-2:2005
Edition 2006-03

Integrated circuits - Measurement of electromagnetic immunity, 150 kHz to 1 GHz - Part 5: Workbench Faraday cage method (IEC 62132-5:2005); German version EN 62132-5:2006
Edition 2006-05