Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components (IEC 61188-5-2:2003)
Edition 2004-06-01

Printed boards and printed board assemblies - Design and use - Part 5-3: Attachment (land/joint) considerations - Components with gull-wing leads on two sides (IEC 61188-5-3:2007)
Edition 2008-08-01

Printed boards and printed board assemblies - Design and use - Part 5-4: Attachment (land/joint) considerations - Components with J leads on two sides (IEC 61188-5-4:2007)
Edition 2008-08-01

Printed boards and printed board assemblies - Design and use - Part 5-5: Attachment (land/joint) considerations - Components with gull-wing leads on four sides (IEC 61188-5-5:2007)
Edition 2008-08-01

Printed boards and printed board assemblies - Design and use - Part 5-6: Attachment (land/joint) considerations - Chip carriers with J-leads on four sides (IEC 61188-5-6:2003)
Edition 2003-11-01

Printed boards and printed board assemblies - Design and use - Part 5-8: Attachment (land/joint) considerations - Area array components (BGA, FBGA, CGA, LGA) (IEC 61188-5-8:2007)
Edition 2008-08-01

Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly (IEC 61190-1-1:2002)
Edition 2003-05-01

Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly (IEC 61190-1-2:2014) (german version)
Edition 2015-11-01

Fibre optic interconnecting devices and passive components - Basic test and measurement procedures - Part 2-33: Tests - Assembly and disassembly of fibre optic mechanical splices, fibre management systems and closures (IEC 61300-2-33:2012) (german version)
Edition 2013-04-01

Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-1: Pull strength test (IEC 62137-1-1:2007)
Edition 2008-03-01