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NF C20-301-2 ; NF EN IEC 61163-2:2020-05-01
Reliability stress screening - Part 2: components
Edition
2020-05-01
NF C93-400-6-1 ; NF EN 60512-6-1:2002-07-01
Connectors for electronic equipment - Tests and measurements - Part 6-1 : dynamic stress tests - Test 6a : acceleration, steady state
Edition
2002-07-01
NF C93-400-6-2 ; NF EN 60512-6-2:2002-07-01
Connectors for electronic equipment - Tests and measurements - Part 6-2 : dynamic stress tests - Test 6b : bump
Edition
2002-07-01
NF C93-400-6-3 ; NF EN 60512-6-3:2002-07-01
Connectors for electronic equipment - Tests and measurements - Part 6-3 : dynamic stress tests - Test 6c : shock
Edition
2002-07-01
NF C93-400-6-4 ; NF EN 60512-6-4:2002-07-01
Connectors for electronic equipment - Tests and measurements - Part 6-4 : dynamic stress tests - Test 6d : vibration (sinusoidal)
Edition
2002-07-01
NF C93-400-6-5 ; NF EN 60512-6-5:2000-05-01
Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Part 6: dynamic stress tests - Section 5 : test 6e : random vibration
Edition
2000-05-01
NF C93-902-24 ; NF EN 61300-2-24:2011-10-01
Fibre optic interconnecting devices and passive components - Basic test and measurement procedures - Part 2-24 : tests - Screen testing of ceramic alignment split sleeve by stress application
Edition
2011-10-01
NF C96-022-5 ; NF EN IEC 60749-5:2024-01-26
Semiconductor devices - Mechanical and climatic test methods - Part 5: steady-state temperature humidity bias life test
Edition
2024-01-26
NF C96-022-5 ; NF EN 60749-5:2017-07-07
Semiconductor devices - Mechanical and climatic test methods - Part 5: steady-state temperature humidity bias life test
Edition
2017-07-07
NF C96-022-20 ; NF EN IEC 60749-20:2020-10-09
Semiconductor devices - Mechanical and climatic test methods - Part 20: resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
Edition
2020-10-09
