Semiconductor devices - Mechanical and climatic test methods - Part 34-1: Power cycling test for power semiconductor module (IEC 47/2759/CD:2022); Text in German and English
Edition 2024-08

Semiconductor devices - Mechanical and climatic test methods - Part 35: Acoustic microscopy for plastic encapsulated electronic components (IEC 60749-35:2006); German version EN 60749-35:2006
Edition 2007-03

Semiconductor devices - Mechanical and climatic test methods - Part 36: Acceleration, steady state (IEC 60749-36:2003); German version EN 60749-36:2003
Edition 2003-12

Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer (IEC 60749-37:2022); German version EN IEC 60749-37:2022
Edition 2023-12

Semiconductor devices - Mechanical and climatic test methods - Part 38: Soft error test method for semiconductor devices with memory (IEC 60749-38:2008); German version EN 60749-38:2008
Edition 2008-10

Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components (IEC 60749-39:2021); German version EN IEC 60749-39:2022
Edition 2023-10

Semiconductor devices - Mechanical and climatic test methods - Part 40: Board level drop test method using a strain gauge (IEC 60749-40:2011); German version EN 60749-40:2011
Edition 2012-02

Semiconductor devices - Mechanical and climatic test methods - Part 41: Standard reliability testing methods of non-volatile memory devices (IEC 60749-41:2020); German version EN IEC 60749-41:2020
Edition 2023-03

Semiconductor devices - Mechanical and climatic test methods - Part 42: Temperature and humidity storage (IEC 60749-42:2014); German version EN 60749-42:2014
Edition 2015-05

Semiconductor devices - Mechanical and climatic test methods - Part 44: Neutron beam irradiated single event effect (SEE) test method for semiconductor devices (IEC 60749-44:2016); German version EN 60749-44:2016
Edition 2017-04