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Standards [CURRENT]

DIN EN 60749-19

Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength (IEC 60749-19:2003 + A1:2010); German version EN 60749-19:2003 + A1:2010
Edition 2011-01

Standards [CURRENT]

DIN EN IEC 60749-20

Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat (IEC 60749-20:2020); German version EN IEC 60749-20:2020
Edition 2023-07

Draft standard

DIN EN IEC 60749-20-1

Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat (IEC 47/2488/CDV:2018); German and English version prEN IEC 60749-20-1:2018
Edition 2018-11

Standards [CURRENT]

DIN EN 60749-20-1

Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat (IEC 60749-20-1:2009); German version EN 60749-20-1:2009
Edition 2009-10

Standards [CURRENT]

DIN EN 60749-21

Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability (IEC 60749-21:2011); German version EN 60749-21:2011
Edition 2012-01

Standards [CURRENT]

DIN EN 60749-22

Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength (IEC 60749-22:200 + Corr. 1:2003); German version EN 60749-22:2003
Edition 2003-12

Standards [CURRENT]

DIN EN 60749-23

Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life (IEC 60749-23:2004 + A1:2011); German version EN 60749-23:2004 + A1:2011
Edition 2011-07

Standards [CURRENT]

DIN EN 60749-24

Semiconductor devices - Mechanical and climatic test methods - Part 24: Accelerated moisture resistance - Unbiased HAST (IEC 60749-24:2004); German version EN 60749-24:2004
Edition 2004-09

Standards [CURRENT]

DIN EN 60749-25

Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling (IEC 60749-25:2003); German version EN 60749-25:2003
Edition 2004-04

Standards [CURRENT]

DIN EN IEC 60749-26 ; VDE 0884-749-26

Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM) (IEC 60749-26:2018); German version EN IEC 60749-26:2018
Edition 2018-10

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