Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat (IEC 60749-20:2020); German version EN IEC 60749-20:2020
Edition 2023-07

Fibre optic sensors - Part 1-1: Strain measurement - Strain sensors based on fibre Bragg gratings (IEC 61757-1-1:2020); German version EN IEC 61757-1-1:2020
Edition 2022-07

Coverings for wells, spring water chambers and other water supply construction - Principles for construction
Edition 2018-04

Single-angle cutters for toolmaking; technical delivery conditions
Edition 1992-03

Non-destructive testing - Characteristics of focal spots in industrial X-ray systems for use in non-destructive testing - Part 5: Measurement of the effective focal spot size of mini and micro focus X-ray tubes; German and English version prEN 12543-5:2024
Edition 2024-08

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures (IEC 61189-2:2006); German version EN 61189-2:2006
Edition 2007-01

Master gears for checking cylindrical gears - Gear blanks and gearing
Edition 2010-04

Geometrical Product Specifications (GPS) - Surface texture: Profile method - Nominal characteristics of contact (stylus) instruments (ISO 3274:1996); German version EN ISO 3274:1997
Edition 1998-04

Plastics - Unplasticized poly(vinyl chloride) (PVC-U) profiles for building applications - Part 2: PVC-U profiles and PVC-UE profiles for internal and external wall and ceiling finishes; German version EN 13245-2:2008 + AC:2009
Edition 2010-11

Copper and copper alloys - Copper profiles and profiled wire for electrical purposes; German version EN 13605:2021
Edition 2021-07