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Guidline

Standards [CURRENT]

DIN EN 14811

Railway applications - Track - Special purpose rail - Grooved rails and associated construction profiles; German version EN 14811:2019
Edition 2019-06

Standards [CURRENT]

DIN EN 62047-25

Semiconductor devices - Micro-electromechanical devices - Part 25: Silicon based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area (IEC 62047-25:2016); German version EN 62047-25:2016
Edition 2017-04

Standards [CURRENT]

DIN EN IEC 60749-30

Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing (IEC 60749-30:2020); German version EN IEC 60749-30:2020
Edition 2023-02

Standards [CURRENT]

DIN EN 62047-11

Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems (IEC 62047-11:2013); German version EN 62047-11:2013
Edition 2014-04

Standards [CURRENT]

DIN EN 62047-13

Semiconductor devices - Micro-electromechanical devices - Part 13: Bend- and shear- type test methods of measuring adhesive strength for MEMS structures (IEC 62047-13:2012); German version EN 62047-13:2012
Edition 2012-10

Standards [CURRENT]

DIN EN 62047-8

Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films (IEC 62047-8:2011); German version EN 62047-8:2011
Edition 2011-12

Standards [CURRENT]

DIN EN 60749-27

Semiconductor devices - Mechanical and climatic test methods - Part 27: Electrostatic discharge (ESD) sensitivity testing - Machine model (MM) (IEC 60749-27:2006 + A1:2012); German version EN 60749-27:2006 + A1:2012
Edition 2013-04

Standards [CURRENT]

DIN EN 62047-4

Semiconductor devices - Micro-electromechanical devices - Part 4: Generic specification for MEMS (IEC 62047-4:2008); German version EN 62047-4:2010
Edition 2011-03

Standards [CURRENT]

DIN EN 62047-6

Semiconductor devices - Micro-electromechanical devices - Part 6: Axial fatigue testing methods of thin film materials (IEC 62047-6:2009); German version EN 62047-6:2010
Edition 2010-07

Standards [CURRENT]

DIN EN 62132-3

Integrated circuits - Measurement of electromagnetic immunity, 150 kHz to 1 GHz - Part 3: Bulk current injection (BCI) method (IEC 62132-3:2007); German version EN 62132-3:2007
Edition 2008-04

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