Semiconductor devices - Mechanical and climatic test methods - Part 40: Board level drop test method using a strain gauge (IEC 60749-40:2011); German version EN 60749-40:2011
Edition 2012-02

Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA) (IEC 60191-6-18:2010 + Cor. :2010); German version EN 60191-6-18:2010
Edition 2010-08

Base materials for printed circuits; part 3: special materials; specification No. 3: permanent polymer coating materials (solder-resist) for use in the fabrication of printed boards; identical with IEC 60249-3-3:1991
Edition 1994-06

Vehicles carrying tools and gears - Part 3: Emergency tender RW
Edition 2016-12

Fire-fighting hoses - Non-percolating layflat delivery hoses and hose assemblies for pumps and vehicles; Amendment A1
Edition 2012-03

Fixed capacitors for use in electronic equipment - Part 4: Sectional specification - Fixed aluminium electrolytic capacitors with solid (MnO₂) and non-solid electrolyte (IEC 60384-4:2016); German version EN 60384-4:2016
Edition 2017-04

Fibre optic active components and devices - Package and interface standards - Part 2: SFF 10-pin transceivers (IEC 62148-2:2010); German version EN 62148-2:2011
Edition 2011-07

Blind rivets - Terminology and definitions (ISO 14588:2000); German version EN ISO 14588:2000
Edition 2001-08

Basic environmental testing procedures; part 2: tests; test XA and guidance: immersion in cleaning solvents (IEC 60068-2-45:1980 + A1:1993); German version EN 60068-2-45:1992 + A1:1993
Edition 1994-02

Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ) (IEC 60191-6-20:2010); German version EN 60191-6-20:2010
Edition 2011-03