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Standards [CURRENT]

DIN 18015-1

Electrical installations in residential buildings - Part 1: Planning principles
Edition 2020-05

Standards [CURRENT]

DIN 20000-403

Application of building products in structures - Part 403: Rules for the application of aggregate concrete masonry units (dense and lightweight aggregates) according to DIN EN 771-3:2015-11
Edition 2019-11

Standards [CURRENT]

DIN IEC 60244-4

Methods of measurement for radio transmitters; part 4: amplitude/frequency characteristics and non-linearity distortion in transmitters for radiotelephony and sound broadcasting
Edition 1983-05

Draft standard [New]

DIN EN 4733-001

Aerospace series - Rectangular optical connector, modular - Operating temperature 125 °C, for EN 4734-10X: MT contacts - Part 001: Technical specification; German version ASD-STAN prEN 4733-001:2024
Edition 2024-09

Standards [CURRENT]

DIN 18197

Sealing of joints in concrete with waterstops
Edition 2018-01

Standards [CURRENT]

DIN EN 61987-15

Industrial-process measurement and control - Data structures and elements in process equipment catalogues - Part 15: Lists of properties (LOPs) for level measuring equipment for electronic data exchange (IEC 61987-15:2016); German version EN 61987-15:2017
Edition 2017-11

Standards [CURRENT]

DIN EN IEC 63155

Guidelines for the measurement method of power durability for surface acoustic wave (SAW) and bulk acoustic wave (BAW) devices in radio frequency (RF) applications (IEC 63155:2020); German version EN IEC 63155:2020
Edition 2021-07

Standards [CURRENT]

DIN EN 60393-2

Potentiometers for use in electronic equipment - Part 2: Sectional specification - Lead-screw actuated and rotary preset potentiometers (IEC 60393-2:2015); German version EN 60393-2:2016
Edition 2016-12

Standards [CURRENT]

DIN EN 61190-1-2

Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly (IEC 61190-1-2:2014); German version EN 61190-1-2:2014
Edition 2014-11

Standards [CURRENT]

DIN EN 62047-9

Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS (IEC 62047-9:2011); German version EN 62047-9:2011
Edition 2012-03

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