Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS (IEC 62047-9:2011); German version EN 62047-9:2011
Edition 2012-03

Electroacoustics - Methods to determine corrections to obtain the free-field response of a sound level meter (IEC 62585:2012); German version EN 62585:2012
Edition 2013-03

Process management for avionics - Counterfeit prevention - Part 1: Avoiding the use of counterfeit, fraudulent and recycled electronic components (IEC 62668-1:2019); German version EN IEC 62668-1:2019
Edition 2021-04

Aerospace series - Programme Management - General guidelines for acquisition and supply of open systems; German and English version EN 9320:2014
Edition 2015-03

Environmental management systems - Requirements with guidance for use (ISO 14001:2015); German and English version EN ISO 14001:2015
Edition 2015-11

Robotics - Safety requirements - Part 1: Industrial robots (ISO/DIS 10218-1.2:2021); German and English version prEN ISO 10218-1:2021
Edition 2021-09

Information security, cybersecurity and privacy protection - Evaluation criteria for IT security - Part 1: Introduction and general model (ISO/IEC 15408-1:2022); German and English version prEN ISO/IEC 15408-1:2023
Edition 2024-01

Home and Building Electronic Systems (HBES) - Part 6-3: 3rd Party HBES IoT API; German version EN 50090-6-3:2023
Edition 2024-08

Process management for avionics - Counterfeit prevention - Part 2: Managing electronic components from non-franchised sources (IEC 62668-2:2019); German version EN IEC 62668-2:2019
Edition 2021-04

Security and resilience - Community resilience - Guidelines for planning the involvement of spontaneous volunteers (ISO 22319:2017); German and English version prEN ISO 22319:2021
Edition 2021-02