Printed boards and printed board assemblies - Design and use - Attachment (land/joint) considerations - Components with gull- wing leads on two sides
Edition 2007-12-31

Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Dimensions and design aspects for 1U high chassis
Edition 2009-02-28

Mechanical structures for electrical and electronic equipment. Thermal management for cabinets in accordance with IEC 60297 and IEC 60917 series. Method for the determination of forced air cooling structure
Edition 2018-07-19

Mechanical structures for electronic equipment. Thermal management for cabinets in accordance with IEC 60297 and IEC 60917 series. Design guide. Interface dimension and provision for thermoelectrical cooling systems (Peltier effect)
Edition 2010-01-31

Mechanical structures for electronic equipment. Thermal management for cabinets in accordance with IEC 60297 and IEC 60917 series. Design guide. Method for the determination of forced air-cooling structure
Edition 2011-08-31

Electroacoustics. Octave-band and fractional-octave-band filters. Pattern-evaluation tests
Edition 2016-06-30

Printed boards and printed board assemblies - Design and use - Attachments (land/joint) considerations - Components with J leads on two sides
Edition 2007-12-31

Self-ballasted fluorescent lamps for general lighting services. Safety requirements
Edition 2015-06-30

Mechanical structures for electronic equipment. Thermal management for cabinets in accordance with IEC 60297 and IEC 60917 series. Design guide. Evaluation method for thermoelectrical cooling systems (Peltier effect)
Edition 2010-02-28

Printed boards and assemblies - Design and use - Attachment (land/joint) considerations - Chip carriers with J-leads on four sides
Edition 2003-06-26