Photovoltaic devices - Part 10: Methods of linear dependence and linearity measurements (IEC 60904-10:2020); German version EN IEC 60904-10:2020
Edition 2022-10

Transformers and inductors for use in electronic and telecommunication equipment - Measuring methods and test procedures (IEC 61007:2020 + COR1:2021); German version EN IEC 61007:2020 + AC:2021
Edition 2021-09

Transformers and inductors for use in electronic and telecommunication equipment - Measuring methods and test procedures (IEC 61007:2020 + COR1:2021); German version EN IEC 61007:2020 + AC:2021; Corrigendum 1
Edition 2021-11

Electroacoustics - Measurement microphones - Part 2: Primary method for pressure calibration of laboratory standard microphones by the reciprocity technique (IEC 61094-2:2009); German version EN 61094-2:2009
Edition 2009-09

Electroacoustics - Measurement microphones - Part 2: Primary method for pressure calibration of laboratory standard microphones by the reciprocity technique (IEC 61094-2:2009/AMD1:2022); German and English version EN 61094-2:2009/A1:2022
Edition 2023-02

Electroacoustics - Measurement microphones - Part 3: Primary method for free-field calibration of laboratory standard microphones by the reciprocity technique (IEC 61094-3:2016 + COR1:2016); German version EN 61094-3:2016 + AC:2017-01
Edition 2017-04

Electroacoustics - Measurement microphones - Part 5: Methods for pressure calibration of working standard microphones by comparison (IEC 61094-5:2016); German version EN 61094-5:2016
Edition 2016-12

Measurement microphones - Part 8: Methods for determining the free-field sensitivity of working standard microphones by comparison (IEC 61094-8:2012); German version EN 61094-8:2012 + AC:2013
Edition 2013-04

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-808: Thermal resistance of dielectric layer by thermal transient method (IEC 91/1690/CD:2020); Text in German and English
Edition 2022-03

Printed board assemblies - Part 6: Evaluation criteria for voids in soldered joints of BGA and LGA and measurement method (IEC 61191-6:2010); German version EN 61191-6:2010
Edition 2011-01