Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA) (IEC 60191-6-22:2012); German version EN 60191-6-22:2013
Edition 2013-08

Surface mounting technology - Part 3: Standard method for the specification of components for through-hole reflow (THR) soldering (IEC 61760-3:2021); German version EN IEC 61760-3:2021
Edition 2022-07

Fibre optic interconnecting devices and passive components - Basic test and measurement procedures - Part 3-30: Examinations and measurements - Endface geometry of rectangular ferrule (IEC 61300-3-30:2020); German version EN IEC 61300-3-30:2021
Edition 2022-08

Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies (IEC 61191-3:2017); German version EN 61191-3:2017
Edition 2018-05

Knitting - Basic concepts - Vocabulary (ISO 4921:2000); German version EN ISO 4921:2001
Edition 2002-04

Fire-fighting vehicles - Part 26: Group pumping appliance for rescue operations HLF 10
Edition 2019-11

Image quality assurance in diagnostic X-ray departments - Part 162: Acceptance test of digital mammography installations
Edition 2022-01

Industrial trucks - Safety requirement - Part 2: Use in narrow aisles
Edition 2013-10

Equipment for commercial kitchens - Non-thermal furnishing components - Part 1: Cupboards - Requirements and testing
Edition 2021-06

Stationary bicycle parking systems - Part 1: Requirements
Edition 2016-05