Coatings for mechanical protection of buried or submerged pipelines - Part 2: Quality assurance for field coatings
Edition 2024-01

Determination of solid state density - Part 3: Gas buoyancy method
Edition 2019-03

Semiconductor devices - Time Dependent Dielectric Breakdown (TDDB) test for gate dielectric films (IEC 62374:2007); German version EN 62374:2007
Edition 2008-02

Electronics assembly technology - Electronic modules (IEC 62421:2007); German version EN 62421:2007
Edition 2008-06

Aerospace series; circuit breakers; technical specification; german version EN 2350:1990
Edition 1991-03

Blank detail specification: Ambient rated photocouplers with phototransistor output; German version EN 120004:1992
Edition 1997-02

Sectional specification: quartz crystal units (capability approval) (includes amendments A1 and A2:1993); German version EN 168100:1993
Edition 1993-06

Thermal insulation and light weight fill products for civil engineering applications - Factory made products of extruded polystyrene foam (XPS) - Specification; German version EN 14934:2007
Edition 2007-12

Metallic coatings - Electroplated coatings of nickel plus chromium and of copper plus nickel plus chromium on plastics materials
Edition 2020-04

Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat (IEC 60749-20:2020); German version EN IEC 60749-20:2020
Edition 2023-07